In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and higher reliability. Monolithic and hybrid system integration will include advanced device concepts (including wide bandgap devices), dedicated ideas for system integration, new ideas on packaging technologies and the overall integration of actuators/drives (mechatronic integration).
CIPS is focussed on three main aspects:
Mechatronic Integration
Hybrid System and Ultra High Power Density Integration
Systems and Components Reliability
Higher power efficiency, density, reliability, and lower volume and cost: How to reach these goals and what solutions are feasible? These topics will be discussed at the 7th CIPS Conference by power electronics experts coming from all over the world.
Power electronics will remain a key technology in the years to come: Energy saving to protect our climate can be done only by using power electronics systems. Those systems can be found in electronic ballasts for fluorescent and discharge lamps, in efficient induction cookers and variable frequency motor drives. Especially the production of wind and solar energy without power electronics is not possible. Also the e-mobility relies on efficient and reliable power electronics systems for driving and charging batteries. Higher efficiencies can be gained by applying system integration based on advanced materials and joining as well as on active and passive components.
Due to improved cooling technologies and reduced use of materials, system costs can be reduced and by applying the “building-in reliability” concept the total system reliability will be improved. Computer aided design and test tools are necessary to achieve a “first right” and robust design.
CIPS 2012 is organized by VDE ETG and ECPE and technically co-sponsored by the IEEE PELS and ZVEI. The conference papers undergo a peer review process which allows their introduction to the IEEE Xplore digital data base.
The Technical Programme Committee selected 85 out of 105 abstracts. 45 of them will be oral and 28 will be poster presentations. The best poster as well as the best young engineer’s presentation will be awarded.
The frame of these presentations is given by three keynote papers and nine invited papers which will provide an overview on the state-of-the-art of the most important topics:
Keynote Papers
Extreme Efficiency Power Electronics: Johann W. Kolar, ETH Zurich, Switzerland
Reliability of Power Electronics Under Thermal Loading: Patrick McCluskey, University of Maryland, USA
SiC Device and Power Module Technologies for Environmentally Friendly Vehicles: Kimimori Hamada, Toyota Motor Corporation, Japan
Invited papers
Advanced Cooling for Power Electronics: Sukhvinder Kang, Aavid, USA
Analysis of Innovative Packaging Technologies and Trends for Power Modules: Alexandre Avron, Yole, France
Electromagnetic Modeling of EMI Input Filters: Andreas Muesing, Gecko Research GmbH, Switzerland
On-chip System Integration: Ashraf Lofti, Enpirion Inc. USA
Combined Reliability Testing: An Approach to Ensure Reliability Under Complex Loading Conditions: Olaf Wittler, Fraunhofer IZM, Germany
Integrated High Power Modules: C. Mark Johnson, University of Nottingham, UK
SiC and GaN Devices – Competition or Coexistence? Nando Kaminski, University of Bremen, Oliver Hilt, FBI Berlin, Germany
Planar Interconnect Technology for Power Module System Integration Norbert Seliger, University of Applied Sciences Rosenheim, Karl Weidner, Siemens CT, Germany
Reliability of the Planar Skin Interconnect Technology:
Uwe Scheuermann, Semikron, Germany
