The success of our global economy relies on the free flow of information and products across multiple geographical boundaries. In a networked society, markets transcend political borders to reach every corner of the globe. With such connectivity come serious challenges to protect the homeland from foreign and domestic threats. The influx of counterfeit electronic components in our supply chain is an ever-increasing threat to our economy. The latest report issued by the US Department of Commerce states that the number of counterfeit incidents almost tripled between 2005 and 2008.

Radiography (or x-ray inspection) is a ubiquitous technique to all recent and upcoming counterfeit detection standards, including IDEA 1010B, CCAP 101, AS5553, AS6081, and AS6171. X-ray inspection gives you the unique ability to “see” what is inside an electronic component without damaging it. To illustrate how x-ray images represent an electronic component, Figure 1a shows a simplified side view diagram of a typical plastic molded part. The top view x-ray of a real plastic molded component is shown in Figure 1b. The dark regions in the x-ray image represent dense areas in the component. Conversely, the light areas represent light areas in the field of view. For this reason the area around the component is represented in white. The x-rays traveling through the different density areas of the component under inspection cast a shadow onto the camera. Thus this x-ray imaging technique is also known as a shadowgram.

Read the complete article on ECN: http://www.ecnmag.com/articles/2014/03/x-ray-inspection-techniques-identify-counterfeit-electronic-components

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